JPH0648892Y2 - 面照光ｌｅｄランプ - Google Patents

面照光ｌｅｄランプ

Info

Publication number
JPH0648892Y2
JPH0648892Y2 JP1988083596U JP8359688U JPH0648892Y2 JP H0648892 Y2 JPH0648892 Y2 JP H0648892Y2 JP 1988083596 U JP1988083596 U JP 1988083596U JP 8359688 U JP8359688 U JP 8359688U JP H0648892 Y2 JPH0648892 Y2 JP H0648892Y2
Authority
JP
Japan
Prior art keywords
electrode
plate
peripheral wall
bare chip
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988083596U
Other languages
English (en)
Japanese (ja)
Other versions
JPH028070U (en]
Inventor
良一 大宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1988083596U priority Critical patent/JPH0648892Y2/ja
Publication of JPH028070U publication Critical patent/JPH028070U/ja
Application granted granted Critical
Publication of JPH0648892Y2 publication Critical patent/JPH0648892Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
JP1988083596U 1988-06-24 1988-06-24 面照光ｌｅｄランプ Expired - Lifetime JPH0648892Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988083596U JPH0648892Y2 (ja) 1988-06-24 1988-06-24 面照光ｌｅｄランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988083596U JPH0648892Y2 (ja) 1988-06-24 1988-06-24 面照光ｌｅｄランプ

Publications (2)

Publication Number Publication Date
JPH028070U JPH028070U (en]) 1990-01-18
JPH0648892Y2 true JPH0648892Y2 (ja) 1994-12-12

Family

ID=31308309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988083596U Expired - Lifetime JPH0648892Y2 (ja) 1988-06-24 1988-06-24 面照光ｌｅｄランプ

Country Status (1)

Country Link
JP (1) JPH0648892Y2 (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994526B2 (en) * 2003-05-28 2011-08-09 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting diode system having at least two heat sinks
KR100616695B1 (ko) * 2005-10-04 2006-08-28 삼성전기주식회사 고출력 발광 다이오드 패키지
JP5206598B2 (ja) * 2009-06-22 2013-06-12 豊田合成株式会社 Ｌｅｄパッケージ
KR101103674B1 (ko) * 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037261U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部の放熱構造
JPS6037260U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部
JPS60102775A (ja) * 1983-11-09 1985-06-06 Toshiba Corp 発光表示装置
JPS6092851U (ja) * 1983-12-01 1985-06-25 舶用電球株式会社 発光ダイオ−ドランプの発光部

Also Published As

Publication number Publication date
JPH028070U (en]) 1990-01-18

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